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CPM : Conductive pattern method
● Using flexible PCB, 3D binding can be applied to the product of any shape, any structure.
● Adhesive binding with min. thickness of Heat Emitting Circuit and Heat Emitting materials
minimizes Heat Radiation.
● Using 100% Insulation Materials provide Withstand Voltage Stability and Light Product.
● Competitive Price with simple Work Process and Materials Saving
General PCB Structure
1.8mm
● Minimize Heat Resistance, Maximize Heat Radiation Effect
● General Metal PCB Thickness : 1.6mm, CPM Method PCB Thickness : 0.2mm
● Assembling Automation
KSB CPM applied to the heatsink features
CPM PCB Structure
0.2mm
KSB Features
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